| Features | |
|---|---|
| Buffered memory type | Unregistered (unbuffered) |
| On-Die ECC | Y |
| CAS latency | 38 |
| Internal memory | 32 |
| Memory layout (modules x size) | 2 x 16 |
| Memory data transfer rate | 4800 |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| ECC | N |
| Memory ranking | 1 |
| Memory voltage | 1.1 |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 |
| Refresh row cycle time | 295 |
| Row active time | 29.12 |
| Intel Extreme Memory Profile (XMP) | Y |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| SPD profile | Y |
| Programming power voltage (VPP) | 1.8 |
| Lead plating | Gold |
| JEDEC standard | Y |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 |
| Storage temperature (T-T) | -55 - 100 |
| Weight & dimensions | |
| Width | 3.8 |
| Depth | 69.6 |
| Height | 30 |
| Weight | 16.8 |
| Packaging data | |
| Package width | 95.25 |
| Package depth | 13.97 |
| Package height | 171.45 |
| Package weight | 46.21 |
| Logistics data | |
| Master (outer) case width | 203.2 |
| Master (outer) case length | 311.15 |
| Master (outer) case height | 101.6 |
| Master (outer) case gross weight | 1367.22 |
| Products per master (outer) case | 25 |
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